IBM Corp., SPA Angstrom and Angstrom-T signed a commercial agreement and a memorandum of understanding on cooperation in the development of technological innovations.
The first agreement is for the provision of IBM technology to produce integrated circuits with 90 nm topology for Angstrom to start the production of microelectronic devices such as microchips and sensors to promote them in the industrial and consumer segments. IBM will also provide its partner the design rules required for contract manufacturing, and will be able to offer Smart Foundry services to Russian and foreign customers.
This agreement will make it possible for us, using the world's leading practices and skills, to be actively involved in the global co-operation and participate in solving serious technological challenges facing the industry, - the General Director of Angstrom-T Anton Alekseev says.
In turn, the MOU specifies the format of cooperation in research and development using innovative technologies.
According to the memorandum, the parties intend to study mutually beneficial models and opportunities for potential cooperation in new markets that require advanced technological innovations and developments. The potential collaboration includes such areas as chemistry, electrical engineering, computer science, materials science, mathematics, physics and microelectronics.